The new Kontron COMe-bCL6 Computer-on-Module in the COM Express basic Type 6 form factor (125 x 95 mm) is equipped with Intel 9th Gen processors and up to four memory sockets enabling a maximum memory expansion of up to 128 GB.

Yamaichi Electronics is growing: Today, the company is laying the foundation stone for a new production site in the Markendorf business park in Frankfurt / Oder. The building in the Müllroser Chaussee will offer modern working environments for production, logistics and office space on around 7,000 square meters. For concept design, planning and building the new location, Yamaichi Electronics relies on Vollack, the expert in methodic building design.

Automated, computer vision-assisted systems objectivize quality control in automobile production. Fraunhofer IGD has developed a method for capturing the actual build of a component and comparing it to the design according to the CAD data – in real time.

With Sinumerik ONE, the first digital native CNC, Siemens is driving forward digital transformation in the machine tool industry. The new controller works with software to create the machine controller and associated digital twin from one engineering system and thus contributes to the seamless integration of hardware and software.

Since 1979 it has been blazing a trail through woods and fields, mud, gravel and snow: the Mercedes G-Class. To make this feasible, the manufacturer uses particularly stable ladder frames. These frames are built at MAGNA Presstec in the Austrian town of Lebring near Graz. Since 2017, production of the facelift model has been running fully automatically on a line from KUKA. Specialists from the two companies collaborated closely to resolve various challenges,...

Laser technology manufacturer SCANLAB is extending its premium-segment product family with the excelliSCAN 20. This new scan system targets exceptionally demanding applications such as micromachining and additive manufacturing (3D printing). The excelliSCAN family’s well-known advantages – smart servo control technology, a universal tuning and optimized cooling – will be supplemented via the new scanner with its larger 20-millimeter aperture.

Spectrophotometry, which examines the light spectrum emitted or absorbed by materials and analyzes their composition, is used in a wide variety of fields including food, agriculture and medicine. Up until now, spectrophotometry was typically performed in a chemical laboratory using large benchtop spectrometers. This SMD series spectrometer is expected to be used in hand-held instruments with limitations to their size or weight, simultaneous multipoint measurements, and other applications.

Infineon Technologies launches the XENSIVTM DPS368. The miniaturized digital barometric pressure sensor is capable of measuring both pressure and temperature. It offers an ultra‑high precision of ±2 cm and a low current consumption for precise measurement of altitude, air flow and body movements.

In many traditionally grown production networks, the focus is on free data exchange across all components and systems. However, if all paths are open, viruses and malware can spread unhindered in the entire network. To prevent this, it is recommended to segment the production network into manageable logical units – for example with the industrial firewall mbNETFIX from MB connect line.

The leading international trade fair for sensor, measuring, and testing technology – SENSOR+TEST – will be held from 25 - 27 June 2019 at the Nuremberg Exhibition Center.

In Bäretswil in the Swiss canton of Zurich Combitool AG – a division of PackSys Global – develops and produces innovative solutions for manufacturing plastic and laminate tubes. To realize the new machine generation of the BLM Laminat Body Maker, the development engineers at Combitool set ambitious goals for themselves. The system should not only be resource friendly, but also significantly increase machine availability and productivity by drastically reducing setup and startup time. The use of...

Small sizes despite high power requirements for the supply of field devices and reliable data transmission: The new CONEC M12x1 two-part sockets with an O‑ring integrated on the insulation body meet the requirements of machine and motor construction.

Top speeds in scanning and parts detection are offering a whole new level of performance in fully automated bin picking. The latest version of already proven IntelliPICK3D, now fitted an innovative four-camera sensor solution enable robust component detection and optimized cycle times: ISRA VISION's wide range of sensor sizes enables the detection of even the tiniest components in the millimeter range. Moreover, easy integration in just a few hours allows maximum flexibility of utilization....

About one months before the opening, the preparations are well underway for the SENSOR+TEST from 25 to 27 June 2019. At the Annual Press Conference of the AMA Association for Sensors and Measurement in Nuremberg, the organizer, Holger Bödeker, had a very positive outlook on this year’s internationally leading trade fair for sensor, measuring, and testing technology.

R. STAHL's Thin Clients cover all requirements for an on-site operation, and have been designed for hazardous as well as for non-hazardous industrial areas. Three different device platforms for varying applications have been developed to suite various application needs.

Powerful electronic devices require high-quality fans with optimized air flow, pressure and low noise levels. In this article Dynetics summarises important criteria for the selection of fans and presents various series from Nidec Servo.

Automation processes in the industrial sector are becoming faster, more efficient, and more intelligent with the development of new technologies. But the things which add value to companies in this industry often present challenges for the internal employees who need to oversee, monitor, manage, develop, or repair these automated and fully optimized processes. With Augmented Reality (AR), workers can be effectively supported along the entire value chain to ensure the best possible human-machine...

TDK Corporation announces the introduction of the TDK-Lambda brand EZA11K‑320240 bi-directional DC-DC converters, suitable for use with energy storage systems. Rated at 11 kW, this 1U high product will operate off a 240–400 Vdc source from a high voltage grid and provide 150 – 300 Vdc for charging lithium ion batteries.

Artificial Intelligence (AI) is no longer a purely academic topic, but is already being used in many practical ways, for example in face recognition, robotics, analytics, health care or smart city applications. Scientific progress requires accelerating machine learning (ML) and deep learning (DL). With the SHARK A.I. series, BRESSNER now has high performance GPU servers in their portfolio that have been specifically developed for such requirements.

With the new series of P-coded M8x1 connectors, CONEC supports the EtherCAT-P single-cable solution developed by Beckhoff and the associated ETG (EtherCAT‑Technologie Group).

Siemens simplifies data transfer within the IIoT to cloud-based solutions with the new Simatic CP 1545-1 communication processor for use with Simatic S7-1500 in modern automation environments. The new industrial IoT gateway Simatic CloudConnect 7 is suitable for the cloud connection of existing systems.

With industrial routers as IoT gateways, data can be collected and analysed – and at the same time adjustments to the system control can be done immediately via remote access. At Hannover Messe 2019, Hall 8, Booth A04/1, MB connect line will demonstrate how this can be done simply and securely.

Guided radar sensors from Balluff are virtually predestined for maintenance-free level measurement of liquids and solids as well as for interface measurement. The guided radar pulses along the probe ensure precise and stable measurement with an absolute repeatability of ±1 mm and a maximum non-linearity of ±2 mm.

In Germany, Europe’s biggest industrial economy, the harnessing of IIoT to digital automation has developed far enough for it to routinely be described as a fourth industrial revolution. However, the more devices, equipment, sensors and applications are connected, the greater the risk of cybercrime.